| Specification | Details |
|---|---|
| Model | HELLER 1809 MK5 |
| Type | Solder Reflow Oven |
| Temperature Range | 150°C to 350°C |
| Heating Zones | 8 zones (4 top, 4 bottom) |
| Max PCB Size | 510mm x 460mm |
| Conveyor Speed | 200 to 1,500 mm/min |
| Power Supply | AC 208-240V, 50/60Hz |
| Total Power | 12 kW |
| Dimensions (LxWxH) | 2,000mm x 1,200mm x 1,400mm |
| Weight | 1,500kg |
| Control System | Windows-based, touch screen interface |
| Soldering Profile | Programmable with ramp and soak settings |
| Certifications | CE, RoHS |
| Energy Efficiency | High efficiency with reduced power consumption |
| Application | PCB soldering, electronics assembly |
HELLER 1809 MK5 Solder Reflow Oven Manufacturer for Precision
The HELLER 1809 MK5 Solder Reflow Oven Manufacturer delivers precise, high-quality soldering for PCB assembly. With advanced heating technology, it ensures uniform temperature profiles, reducing defects and improving efficiency in high-volume production. Ideal for electronics manufacturing with reliable performance and energy efficiency.
