| Specification | Description |
|---|---|
| Model | HELLER 1809 MK7 Reflow Oven |
| Temperature Range | 150°C to 350°C |
| Conveyor Speed | 0.5 to 1.5m/min |
| Number of Heating Zones | 8 zones (4 top, 4 bottom) |
| Maximum Board Size | 460mm x 510mm |
| Heating Method | Forced convection with active cooling |
| Power Supply | 400V, 50/60Hz |
| Dimensions (LxWxH) | 2450mm x 820mm x 1350mm |
| Weight | Approx. 1000kg |
| Control System | Touchscreen with programmable settings |
| Energy Efficiency | High-efficiency components for reduced energy consumption |
| Cooling Method | Dual-zone cooling system |
HELLER 1809 MK7 Reflow Oven Manufacturer Reliable Performance
The HELLER 1809 MK7 Reflow Oven is designed for high-efficiency soldering in electronics manufacturing. Offering reliable performance, it ensures optimal heat distribution for consistent, high-quality results. Ideal for large-scale production, it guarantees fast cycle times, precision, and durability in demanding environments.
