| Attribute | Specification |
|---|---|
| Model | 1809EXL |
| Temperature Range | 150°C – 350°C |
| Heating Zones | 8 zones (4 top, 4 bottom) |
| Conveyor Speed | 0.4 – 2.0 m/min |
| Max PCB Size | 460mm x 360mm |
| Power Supply | AC 380V-415V, 50/60Hz |
| Dimensions (LxWxH) | 1,800mm x 1,200mm x 1,500mm |
| Weight | Approx. 750kg |
| Operating Temperature | 20°C – 35°C |
| Control System | Digital touchscreen, PLC control |
Original Spot goods Heller 1809EXL Reflow Oven Manufacturer
The Heller 1809EXL Reflow Oven offers advanced soldering solutions with precise temperature control for high-quality PCB assembly. Designed for efficiency, it ensures excellent heat distribution, low energy consumption, and superior reliability in high-volume production environments.
