| Attribute | Details |
|---|---|
| Model | Saki 3Si 3D SPI |
| Type | 3D Solder Paste Inspection (SPI) Machine |
| Applications | PCB solder paste inspection, quality control |
| Technology | 3D optical inspection with high-definition imaging |
| User Interface | Touchscreen interface for easy control |
| Inspection Speed | High-speed inspection for high-volume PCB production |
| Inspection Accuracy | High precision for detecting solder paste defects |
| Connectivity | Factory automation and integration-ready |
| Dimensions (Approx.) | Compact, designed for production lines |
| Weight | Typically around 500 kg (depending on configuration) |
| Power Requirements | 3-phase AC, standard for industrial machines |
| Output | Detailed inspection results for quality assurance |
Original Factory Saki 3Si 3D SPI Supplier for PCB Inspection
The Saki 3Si 3D SPI provides precise solder paste inspection for PCB assembly. Featuring advanced 3D imaging technology, it ensures high-quality inspection and defect detection. With a user-friendly interface and high throughput, it is perfect for high-volume manufacturing lines requiring fast and reliable inspection.
