Key Features
- High-speed full inspection after taping process
- Advanced vision system for accurate defect detection
- Automatic sorting for pass/fail results
- Supports multiple component sizes and tape formats
- User-friendly interface with intuitive control
- Compact design for seamless integration into production line
Technical Specifications
| Item | Specification |
|---|---|
| Inspection Type | 100% full inspection after taping |
| Detection Method | High-resolution vision system |
| Component Size Range | Customizable (standard IC, SMD, etc.) |
| Tape Width Compatibility | 8mm–56mm (optional customization) |
| Inspection Speed | Up to 30,000 units/hour (model dependent) |
| Defect Detection | Missing, misplacement, orientation, defects |
| Sorting Method | Automatic NG/OK binning |
| Control System | PLC + Touchscreen HMI |
| Data Output | SPC data, traceability reports |
| Power Supply | AC 220V, 50/60Hz |
| Machine Dimensions | Approx. 1200mm × 800mm × 1600mm |
| Weight | ~450 kg |
Applications
- Post-taping inspection for semiconductors and SMDs
- Quality control in electronic component packaging
- OEM/ODM production lines requiring high precision
