HELLER 1809 MK III Solder Reflow Oven Trusted Distributor

The HELLER 1809 MK III Solder Reflow Oven, offered by a trusted distributor, delivers superior soldering performance with precise thermal control, instant response heating, and advanced forced convection zones. Designed for high-volume PCB production, it ensures consistent solder quality, efficient cooling, and reliability in demanding SMT assembly environments.

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Conveyor System

SpecificationValue
Mesh Belt Conveyor Height35.5″ + 2.0″ (90 cm + 5 cm)
Maximum PCB Width18″ (46 cm) / 22” (56 cm) with wider module
Space Required Between PCBs0.0″ (0.0 cm)
Conveyor Length On-Load18″ (46 cm) * 3″ (7.5 cm)
Conveyor Length Off-Load18″ (46 cm) * 3″ (7.5 cm)
Heated Tunnel Length105″ (254 cm)
Process Clearance Above Mesh Belt2.3″ (5.8 cm)
Mesh Belt Pitch0.5″ (1.27 cm)
Maximum Conveyor Speed74″/Min (188 cm/min)
Conveyor DirectionLeft to Right (Standard), Right to Left (Optional)
Conveyor Speed ControlClosed Loop

Edge Hold Conveyor System

SpecificationValue
Height from Floor – Standard37.0″ + 2.0″ (94 cm + 5 cm)
Height from Floor – Optional32.6″ +3.9″ / -.4″ (83 cm +10 cm / -1 cm)
Clearance Above & Below Conveyor Pins1.15″ (2.9 cm)
Length of PCB Support Pins0.187″ (4.75 mm)
3 mm Long Support PinsOptional
Minimum/Maximum Board Width2.0″–18″ (5–46 cm), up to 22” (56 cm) optional
Power Width AdjustmentStandard
Computer Controlled Width AdjustOptional
Auto Lubrication SystemOptional

Heating System

SpecificationValue
Forced Convection Zones (Top & Bottom)9
Heater TypeInstant response open coil
Heater MaterialNichrome
Profile Change Time5 – 15 minutes
Temperature Control Accuracy±0.1°C
Cross-Belt Temperature Tolerance±2.0°C
Heater Wattage Per Zone6000 W
Temperature Range Standard60 – 350°C
High Temperature OptionUp to 450°C

Cooling System

SpecificationValue
Number of Cooling Zones (Standard)2
Additional Cooling ZonesOptional
Water CoolingOptional