Equipment Features
- Gantry structure with flying optical path for easy production line integration
- Optional dedicated IN-LINE loading/unloading system for full automation
- Tailored for high-precision FPC and PCB processing
- Greatly improves production efficiency
Technical Specifications
| Parameter Category | Parameter Value |
|---|---|
| Equipment Model | MF-6000PII |
| Machine Size | 1350mm × 1150mm × 1550mm (without warning light & FFU) |
| Machine Net Weight | 1500 KG |
| Working Area | 460mm × 460mm |
| Input Power | 3KW (without vacuum extraction device) |
| Machine Body | Marble |
| Laser | UV nanosecond / picosecond (optional) |
| Cutting Thickness | ≤1.6 mm (depending on material) |
| Overall Machine Accuracy | ±0.02mm |
| Positioning Accuracy | ±0.002mm |
| Repeat Accuracy | ±0.002mm |
| Spot Diameter | 20 ± 5 μm |
| Positioning Method | Automatic positioning |
| Compensation Method | Automatic compensation |
| Ambient Temperature | 22 ± 2 ℃ |
| Ambient Humidity | ＜60 % |
| File Format | GBR, DXF |
