JUTZE Mirage 3D SPI OEM Manufacturer High-Precision System

JUTZE Mirage 3D SPI OEM Manufacturer High-Precision System delivers advanced solder paste inspection with dual 2D/3D imaging, RGB+White LED lighting, and high-speed cameras. Offering accurate detection of defects like bridging, voids, or insufficient paste, it ensures reliable PCB quality control with automated handling.

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ParameterMirageMirage-D
ModelMirageMirage-D
Lighting SystemRGB + White LED ring lightingRGB + White LED ring lighting
Vision System3D two-direction digital projector3D two-direction digital projector
Camera4M / 12M industrial high-speed4M / 12M industrial high-speed
Resolution10µm – 15µm (adjustable)10µm – 15µm (adjustable)
Height Resolution1µm1µm
Product SizeW1080 × D1300 × H1850mmW1083 × D1445 × H1800mm
Weight777 KG950 KG
FOV Size30.6 × 30.6mm (4M/15µm)40.9 × 30.7mm (12M/10µm)
PCB Size50 × 70mm – 510 × 460mmSingle lane: 50 × 70mm – 510 × 590mm
Dual lanes: 50 × 70mm – 510 × 330mm
PCB Thickness0.6mm – 6mm0.6mm – 6mm
Warpage Compensation±3mm±3mm
Inspection Theory2D + 3D image data analysis2D + 3D image data analysis
Inspection Speed330ms / FOV (2D+3D)330ms / FOV (2D+3D)
Inspection DefectsInsufficient paste, excessive paste, bridging, shifting, no paste, shorts, icicles, shape defects
Conveyor SystemBottom-up fix board clamping; Automatic loading/unloading; Auto rail width adjustment; SMEMA standard; Rail height: 900 ± 20mm
Power RequirementsAC 220V, 50/60Hz, 1.8 KVAAC 220V, 50/60Hz, 1.8 KVA
Air Requirements0.5 MPa0.5 MPa
EnvironmentTemp: 5–40℃; Humidity: 25%–80% RHTemp: 5–40℃; Humidity: 25%–80% RH
InterfacesSMEMASMEMA