| Feature | Description |
|---|---|
| Model | BF-Sirius 3D AOI |
| Application | PCB Inspection |
| Inspection Method | 3D Automated Optical Inspection |
| Resolution | 10µm pixel resolution |
| Inspection Speed | 65,000 UPH (Units per Hour) |
| Max PCB Size | 510mm x 460mm |
| Component Size Range | 0201 to 50mm |
| Defect Detection | Solder bridges, voids, misalignment, defects |
| Height Measurement | True 3D profiling with high precision |
| Control System | AI-driven image processing |
| Power Consumption | 1.8 kVA |
| Dimensions | 1,800mm x 1,300mm x 1,500mm |
| Weight | 2,100kg |
Saki BF-Sirius 3D AOI Dealer High-Accuracy Inspection System
The Saki BF-Sirius 3D AOI delivers high-accuracy automated optical inspection for complex PCB assemblies. With advanced 3D imaging and powerful algorithms, it detects solder defects, misalignments, and assembly errors. Designed for high-volume production, it ensures maximum reliability and consistent quality control.
